AR-9 Platform
Rev 04
Next-Generation Compute for Intelligent Machines

Industrial
Silicon
And
Digital
Control
To
Execute
With
Certainty
A sealed AI compute module combining silicon, firmware, and deployment tools into one secure platform.
Built as one platform from die to deployment, improving reliability, traceability, and deployment consistency.

Bonding flow plan and asymmetries
Drawing no. AR/9-04
SCALE 1:2
The Sealed Module System That Reduces Risk and Provides Certainty
Integrates compute, memory, security, and thermal mass within an industrial framework. It connects the model, firmware, and fleet, turning machine intelligence into a planned assembly process.
Every Gram Is Purpose-Built Load-Bearing
Four layers, one sealed unit. Nothing decorative, nothing you'll need to source separately.
PRODUCT LINEUP
Three Modules. One Toolchain.
Same architecture and firmware across the range. Your code moves between SKUs without a rewrite; only the thermal envelope changes.
Your Model Runs Before Lunch.
Hardware teams judge the silicon by the SDK. Ours accepts PyTorch, JAX, and ONNX, quantizes with one flag, and ships with zero-copy DMA into ROS 2. No model zoo lock-in.
01
Compile any PyTorch/ONNX graph with one command
02
ROS 2 Iron & Jazzy native, zero-copy camera DMA
03
Fleet OTA updates with per-unit attestation
How it works
From Eval Kit To Volume, In Four Planned Steps
AI Hardware Built For Imapact
Overview
The System Built for Control and Traceability
Hardware is only valuable when it can be deployed, tracked, and supported at scale. From certifications to production commitments, every module is documented for predictable integration and long-term supply.

Every layer is deterministic.




